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Kini PCB SMT Stencil (Apá 4)
Jẹ ki a tẹsiwaju lati ṣafihan apakan miiran ti awọn ofin PCB SMT. Intrusive Soldering Iyipada Titẹ sita Paadi Squeegee Iwọn BGA Stencil Igbesẹ Stencil Imọ-ẹrọ Oke-Ida (SMT)* Nipasẹ-Iho Technology (THT)* Ultra-Fine ipolowo Technology
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Kini PCB SMT Stencil (Apá 3)
Loni, a yoo ṣafihan apakan ti awọn ofin ti PCB SMT. 1. Iho 2. Aspect Ratio ati Area Ratio 3. Aala 4. Solder Lẹẹ Igbẹhin Print Head 5. Etch ifosiwewe 6. Fiducials 7. Pitch BGA/Iwọn Iwọn Chip (CSP) Fine-Pitch 8. ine-Pitch Technology (FPT)* 9. Foils 10. fireemu
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Kini PCB SMT Stencil (Apá 2)
Loni a yoo ṣafihan Isọri ti SMT Stencil lati lilo, ilana, ati ohun elo.
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Kini PCB SMT Stencil (Apá 1)
Loni, jẹ ki a kọ ẹkọ nipa itumọ PCB SMT Stencil. SMT Stencil naa, ti a mọ ni alamọdaju bi “awoṣe SMT,” jẹ eyiti o wọpọ julọ ti irin alagbara, ti a tọka si bi stencil irin.
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Aṣiri PCB Iyara Giga (Apá 2)
Jẹ ki a tẹsiwaju kọ ẹkọ nipa awọn ofin ti o wọpọ ti PCB iyara giga. 1. Igbẹkẹle 2. Impedance
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Aṣiri PCB Iyara Giga (Apá 1)
Loni a yoo sọrọ nipa, awọn ofin ti o wọpọ ti PCB iyara giga. 1. Oṣuwọn iyipada 2. Iyara
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Itumọ “LAYER” ni iṣelọpọ PCB. (Apá 7)
Bi awọn nọmba ti fẹlẹfẹlẹ ni multilayer tejede Circuit lọọgan, kọja kẹrin ati kẹfa fẹlẹfẹlẹ, diẹ conductive Ejò fẹlẹfẹlẹ ati dielectric awọn ohun elo ti fẹlẹfẹlẹ ti wa ni afikun si awọn akopọ-soke.
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Itumọ “LAYER” ni iṣelọpọ PCB. (Apá 6)
A 6-Layer PCB jẹ pataki kan 4-Layer ọkọ pẹlu afikun ti 2 afikun ifihan agbara fẹlẹfẹlẹ laarin awọn ofurufu.
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Itumọ “LAYER” ni iṣelọpọ PCB. (Apá 5)
Loni, a tesiwaju lati jiroro lori multilayer PCB, awọn mẹrin-Layer PCB
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Itumo “LAYER” ni iṣelọpọ PCB.(Apá 2)
Loni, a yoo tẹsiwaju lati kọ ẹkọ nipa awọn okunfa ti o pinnu iye awọn fẹlẹfẹlẹ PCB ti a ṣe lati ni.